Light guide array for an image sensor

ABSTRACT

An image sensor pixel that includes a photoelectric conversion unit supported by a substrate and an insulator adjacent to the substrate. The pixel includes a cascaded light guide that is located within an opening of the insulator and extends above the insulator such that a portion of the cascaded light guide has an air interface. The air interface improves the internal reflection of the cascaded light guide. The cascaded light guide may include a self-aligned color filter having air-gaps between adjacent color filters. Air-gaps may be sealed from above by a transparent sealing film. The transparent sealing film may have a concave surface over the air-gap to diverge light that crosses the concave surface into the air-gap away from the air-gap into adjacent color filters. These characteristics of the light guide eliminate the need for a microlens. Additionally, a portion of a support wall between a pair of color filters may have a larger width above than below to form a necking to hold down the color filters for better retention.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to U.S. patent application Ser. No.12/806,192 filed on Jul. 2, 2009, which was converted to non-provisionalfrom U.S. Provisional Patent Application No. 61/222,835 filed on Jul. 2,2009.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The subject matter disclosed, generally relates to structures andmethods for fabricating solid state image sensors.

2. Background Information

Photographic equipment such as digital cameras and digital camcordersmay contain electronic image sensors that capture light for processinginto still or video images. Electronic image sensors typically containmillions of light capturing elements such as photodiodes.

Solid state image sensors can be either of the charge coupled device(CCD) type or the complimentary metal oxide semiconductor (CMOS) type.In either type of image sensor, photo sensors are formed in a substrateand arranged in a two-dimensional array. Image sensors typically containmillions of pixels to provide a high-resolution image.

FIG. 1A shows a sectional view of a prior art solid-state image sensor 1showing adjacent pixels in a CMOS type sensor, reproduced from U.S. Pat.No. 7,119,319. Each pixel has a photoelectric conversion unit 2. Eachconversion unit 2 is located adjacent to a transfer electrode 3 thattransfers charges to a floating diffusion unit (not shown). Thestructure includes wires 4 embedded in an insulating layer 5. The sensortypically includes a flattening layer 6 below the color filter 8 tocompensates for top surface irregularities due to the wires 4, since aflat surface is essential for conventional color filter formation bylithography. A second flattening layer 10 is provided above the colorfilter 8 to provide a flat surface for the formation of microlens 9. Thetotal thickness of flattening layers 6 and 10 plus the color filter 8 isapproximately 2.0 um.

Light guides 7 are integrated into the sensor to guide light onto theconversion units 2. The light guides 7 are formed of a material such assilicon nitride that has a higher index of refraction than theinsulating layer 5. Each light guide 7 has an entrance that is widerthan the area adjacent to the conversion units 2. The sensor 1 may alsohave a color filter 8 and a microlens 9.

The microlens 9 focuses light onto the photo photoelectric conversionunits 2. As shown in FIG. 1B because of optical diffraction, themicrolens 9 can cause diffracted light that propagates to nearbyphotoelectric conversion units and create optical crosstalk and lightloss. The amount of cross-talk increases when there is a flatteninglayer above or below the color filter, positioning the microlens fartheraway from the light guide. Light can crosstalk into adjacent pixels bypassing through either flattening layer (above or below color filter) orthe color filter's sidewall. Metal shields are sometimes integrated intothe pixels to block cross-talking light. In addition, alignment errorsbetween microlens, color filter, and light guide also contribute tocrosstalk. The formation, size, and shape of the microlens can be variedto reduce crosstalk. However, extra cost must be added to the precisemicrolens forming process, and crosstalk still cannot be eliminated.

Backward reflection from the image sensor at the substrate interface isanother issue causing loss of light reception. As shown in FIG. 1A, thelight guide is in direct contact with the silicon. This interface cancause undesirable backward reflection away from the sensor. Conventionalanti-reflection structures for image sensors include the insertion of aoxide-plus-nitride dual-layer film stack directly above the siliconsubstrate, or a oxynitride layer having variation of nitrogen-to-oxygenratio there, but only reduces reflection between the silicon substrateand a tall oxide insulator. This approach is not applicable when theinterface is silicon substrate and a nitride light guide.

BRIEF SUMMARY OF THE INVENTION

An image sensor pixel that includes a photoelectric conversion unitsupported by a substrate and an insulator adjacent to the substrate. Thepixel may have a cascaded light guide, wherein a portion of the cascadedlight guide is within the insulator and another portion extends abovethe insulator. The cascaded light guide may include a self-aligned colorfilter having air-gaps between adjacent color filters. Air-gaps may besealed from above by a transparent sealing film. The transparent sealingfilm may have a concave surface over the air-gap to diverge light awayfrom the air-gap into adjacent color filters. The pixel may have ananti-reflection stack between the substrate and the cascaded lightguide.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is an illustration showing a cross-section of two image sensorpixels of the prior art;

FIG. 1B is an illustration showing light cross-talk between adjacentpixels of the prior art;

FIG. 2 is an illustration showing a cross-section of two image sensorpixels of an embodiment of one of the inventions herein;

FIG. 3A is an illustration showing light traveling along an air gapbetween two color filters;

FIG. 3B is an illustration showing the redirection of light from the airgap into the color filters;

FIG. 3C is a graph of light power versus the distance along the air gap;

FIG. 3D is a graph of gap power loss versus gap width versus distancealong the air gap of widths 0.6 um and 1.0 um for three differentcolors;

FIG. 3E is a graph of maximal gap power loss versus gap width at a depthof 1.0 um;

FIG. 3F is a table of maximal gap power loss for different gap widths ata depth of 1.0 um;

FIG. 3G is a table of gap area as percentage of pixel area for differentgap widths and different pixel pitches;

FIG. 3H is a table of pixel power loss for different gap widths anddifferent pixel pitches;

FIG. 3I is a graph of pixel power loss versus pixel pitch for differentgap widths;

FIGS. 4A-L are illustrations showing a process used to fabricate thepixels shown in FIG. 2;

FIG. 5 is an illustration showing ray traces within the pixel of FIG. 2;

FIG. 6A is an illustration showing a pixel at a corner of the array;

FIG. 6B is an illustration showing light ray traces within the pixel ofFIG. 6A;

FIG. 7 is an illustration showing a top view of four pixels within anarray;

FIG. 8 is an alternate embodiment of the sensor pixels with ray tracing;

FIGS. 9A-M are illustrations showing a process used to fabricate thepixels shown in FIG. 8;

FIGS. 10A-H are illustrations showing a process to expose a bond pad;

FIG. 11 is an illustration showing an anti-reflection stack within thesensor of an embodiment of one of the inventions herein;

FIGS. 12A-E are illustrations showing an alternate process to form ananti-reflection stack within the sensor of an embodiment of one of theinventions herein;

FIG. 13A is a graph of transmission coefficient versus light wavelengthfor an anti-reflection stack;

FIG. 13B is a graph of transmission coefficient versus light wavelengthfor the anti-reflection stack;

FIG. 13C is a graph of transmission coefficient versus light wavelengthfor the anti-reflection stack;

FIGS. 14A-G are illustrations showing an alternate process to form twoanti-reflection stacks within the sensor of an embodiment of one of theinventions herein;

FIG. 15A is a graph of transmission coefficient versus light wavelengthfor a first anti-reflection stack on a left hand portion of FIG. 14G;

FIG. 15B is a graph of transmission coefficient versus light wavelengthfor a second anti-reflection stack shown on a right hand portion of FIG.14G;

FIG. 16 shows an alternate embodiment of the image sensor of one of theinventions herein;

FIG. 17 shows an alternate embodiment of the image sensor of one of theinventions herein;

FIG. 18 shows an alternate embodiment of the image sensor of one of theinventions herein;

FIG. 19 shows an alternate embodiment of the image sensor of one of theinventions herein;

FIG. 20 is an illustration showing a process step used to fabricate thepixels shown in FIG. 18;

FIG. 21 shows an alternate embodiment of the image sensor of one of theinventions herein;

FIGS. 21A-D are illustrations showing process steps used to fabricatethe pixels shown in FIG. 19;

FIG. 22 shows an alternate embodiment of the image sensor of one of theinventions herein;

FIG. 23 is an illustration showing ray traces crossing from cover glassto the light guides in a image sensor package according to an embodimentof one of the inventions herein;

FIG. 24 is an illustration showing a packaging configuration of one ofthe inventions herein.

DETAILED DESCRIPTION

Disclosed is an image sensor pixel that includes a photoelectricconversion unit supported by a substrate and an insulator adjacent tothe substrate. The pixel includes a light guide that is located withinan opening of the insulator and extends above the insulator such that aportion of the light guide has an air interface. The air interfaceimproves the internal reflection of the light guide. Additionally, thelight guide and an adjacent color filter are constructed with a processthat optimizes the upper aperture of the light guide and reducescrosstalk. These characteristics of the light guide eliminate the needfor a microlens. Additionally, an anti-reflection stack is constructedabove the photoelectric conversion unit and below the light guide toreduce light loss through backward reflection from the image sensor. Twopixels of different color may be individually optimized foranti-reflection by modifying the thickness of one film within theanti-reflection stack.

The pixel may include two light guides, one above the other. The firstlight guide is located within a first opening of the insulator adjacentto the substrate. The second light guide is located within a secondopening in a support film, which may be eventually removed or partiallyremoved during fabrication of the pixel. A color filter may be locatedwithin the same opening and thus self-aligns with the second lightguide. The second light guide may be offset from the first light guideat the outer corners of the pixel array to capture light incident at anon-zero angle relative to the vertical axis.

An air gap is created between neighboring color filters by removing thesupport film material adjacent to the filter. Air has a lower refractiveindex than the support film and enhances internal reflection within thecolor filter and the light guide. In addition, the air gap is configuredto “bend” light incident on the gap into the color filter and increasethe amount of light provided to the sensor.

Reflection at the silicon-light-guide interface is reduced by creating anitride film and a first oxide film below the first light guide. Asecond oxide film may be additionally inserted below the nitride film tobroaden the range of light frequencies for effective anti-reflection.The first oxide film can be deposited into an etched pit beforeapplication of the light-guide material. In an alternate embodiment, allanti-reflection films are formed before a pit is etched, and anadditional light-guide etch-stop film covers the anti-reflection filmsto protect them from the pit etchant.

Referring to the drawings more particularly by reference numbers, FIGS.2, 4A-L, 5 and 6A-B show embodiments of two adjacent pixels in an imagesensor 100. Each pixel includes a photoelectric conversion unit 102 thatconverts photonic energy into electrical charges. In a conventional 4 Tpixel, electrode 104 may be a transfer electrode to transfer the chargesto a separate sense node (not shown). Alternately, in a conventional 3 Tpixel, electrode 104 may be a reset electrode to reset the photoelectricconversion unit 102. The electrodes 104 and conversion units 102 areformed on a substrate 106. The sensor 100 also includes wires 108 thatare embedded in an insulating layer 110.

Each pixel has a first light guide 116. The first light guides 116 areconstructed with a refractive material that has a higher index ofrefraction than the insulating layer 110. As shown in FIG. 4B, eachfirst light guide 116 may have a sidewall 118 that slopes at an angle αrelative to a vertical axis. The angle α is selected to be less than90−a sin(n_(insulating layer)/n_(light guide)), preferably 0, so thatthere is total internal reflection of light within the guide, whereinn_(insulating layer) and n_(light guide) are the indices of refractionfor the insulating layer material and light guide material,respectively. The light guides 116 internally reflect light from thesecond light guide 130 to the conversion units 102.

The second light guides 130 are located above first light guides 116 andmay be made from the same material as the first light guide 116. The topend of the second light guide 130 is wider than the bottom end, wherethe second light guide 130 meets the first light guide 116. Thus the gapbetween adjacent second light guides 130 at the bottom (henceforth“second gap”) is larger than at the top, as well as larger than the airgap 422 between the color filters 114B, 114G above the second lightguides 130. The second light guides 130 may be offset laterally withrespect to the first light guides 116 and/or the conversion unit 102, asshown in FIG. 6A, wherein the centerline C2 of the second light guide130 is offset from the centerline C1 of the first light guide 116 or ofthe photoelectric conversion unit 102. The offset may vary dependingupon the pixel position within an array. For example, the offset may begreater for pixels located at the outer portion of the array. The offsetmay be in the same lateral direction as the incident light to optimizereception of light by the first light guide. For incident light arrivingat a nonzero angle relative to the vertical axis, offset second lightguides 130 pass on more light to the first light guides 116. Effectivelysecond light guide 130 and first light guide 116 together constitute alight guide that takes different vertical cross-section shapes atdifferent pixels. The shape is optimized to the incident light ray angleat each pixel.

FIGS. 5 and 6B illustrate ray tracing for a pixel at the center of anarray and at a corner of the array, respectively. In FIG. 5, incidentlight rays come in vertically. The second light guides 130 are centeredto the first light guides 116. Both light rays a and b reflect oncewithin the second light guide 130 then enter the first light guide 116,reflects once (ray a) or twice (ray b) and then enter conversion units102. In FIG. 6B, the second light guides 130 are offset to the right,away from the center of the array, which is towards the left. Light rayc, which comes in from the left at an angle up to 25 degrees relative tothe vertical axis, reflects off the right sidewall of the second lightguide 130, hits and penetrates the lower-left sidewall of the same,enters the first light guide 116, and finally reaches conversion unit102. The offset is such that the first light guide 116 recaptures thelight ray that exits lower-left sidewall of second light guide 130. Ateach crossing of light guide sidewall, whether exiting the second lightguide or entering the first light guide, light ray c refracts in a waythat the refracted ray's angle to the vertical axis becomes less eachtime, enhancing propagation towards the photoelectric conversion unit.Thus, having a light guide built from a first light guide 116 and asecond light guide 130 allows the vertical cross-section shape of thelight guide to vary from pixel to pixel to optimize for passing light tothe photoelectric conversion unit 102.

Building a light guide from two separate light guides 116, 130 has asecond advantage of reducing the etch depth for each light guide 116,130. Consequently, side wall slope angle control can achieve higheraccuracies. It also makes deposition of lightguide material less likelyto create unwanted keyholes, which often happen when depositing thinfilm into deep cavities, causing light to scatter from the light guideupon encountering the keyholes.

Color filters 114B, 114G are located above the second light guides 130.The sidewall upper portion at and adjacent to the color filters is morevertical than the rest of second lightguide.

First air-gap 422 between the color filters has a width of 0.45 um orless, and a depth of 0.6 um or greater. An air gap with the dimensionallimitations cited above causes the light within the gap to be divertedinto the color filters and eventually to the sensors. Thus thepercentage loss of light impinging on the pixel due to passing throughthe gap (henceforth “pixel loss”) is substantially reduced.

Light incident upon a gap between two translucent regions of higherrefractive indices become diverted to one or the other when the gap issufficiently narrow. In particular, light incident upon an air gapbetween two color filters diverts to one color filter or the other whenthe gap width is sufficiently small. FIG. 3A shows a vertical gapbetween two color filter regions filled with a lower refractive indexmedium, e.g. air. Incident light rays entering the gap and nearer onesidewall than the other is diverted towards and into the former, whereasthe rest are diverted towards and into the latter. FIG. 3B showswavefronts spaced one wavelength apart. Wavefronts travel at slowerspeed in higher refractive index medium, in this example the colorfilter having an index n of approximately 1.6. Thus the spacing betweenwavefronts in the gap, assuming air filled, is 1.6 times that of thecolor filter, resulting in the bending of wavefronts at the interfacebetween the color filter and air gap and causing the light rays todivert into the color filter. FIG. 3C is a graph of propagated lightpower P(z) along a vertical axis z of the air gap divided by theincident light power P(0) versus a distance z. As shown by FIG. 3C,light power decreases deeper into the gap for different gap widths, morerapidly for lesser gap widths on the order of one wavelength andconverges to be essentially negligible for a gap width of 0.4 timeswavelength or less at a depth of 1.5 times wavelength. From FIG. 3C, itis preferable to have a depth equal to at least 1 times the wavelengthof the longest wavelength of interest, which is 650 nm in thisembodiment for a visible light image sensor. At this depth, thepercentage of light power incident upon the gap and lost to the spacefurther below (henceforth “gap loss”) is less than 15%. The color filterthus needs to have thickness at least 1 time the wavelength in order tofilter incident light entering the gap to prevent unfiltered light frompassing on to light guides 130, 114 and eventually to the conversionunit 102. If the gap is filled with a transparent medium other than air,with refractive index n_(gap)>1.0, then presumably the gap would need tonarrow to 0.45 um/n_(gap) or less, since effectively distances in termsof wavelength remains the same but absolute distances are scaled by1/n_(gap).

Referring to FIG. 3C, for red light of wavelength in air of 650 nm, at adepth of 0.65 um (i.e. 1.0 time wavelength in air) the gap power fluxattenuates to 0.15 (15%) for a gap width of 0.6 time wavelength in air,i.e. 0.39 um. Attenuation reaches maximum at around 1 um of depth.Attenuation is steeper with depth for shorter wavelengths.

FIG. 3D shows the gap loss versus gap width W for 3 colors—blue at 450nm wavelength, green at 550 nm, and red at 650 nm—at depths of 0.6 umand 1.0 um, respectively. For a depth of 1.0 um, the highest gap lossamong the 3 colors and the maximal gap loss for gap widths of 0.2 um to0.5 um are plotted in FIG. 3E. Gap loss against gap width is tabulatedin FIG. 3F. In FIG. 3G, gap area as percentages of pixel areas istabulated against pixel pitch and gap width. Each entry (percentage gaparea) in the table of FIG. 3G is multiplied with the correspondingcolumn entry (i.e. gap loss) to give pixel loss as tabulated in FIG. 3H.FIG. 3I plots pixel loss versus pixel pitch for different gap widthsranging from 0.2 um to 0.5 um.

FIG. 3I shows that keeping gap width below 0.45 um would result in lessthan 8% pixel loss for pixel pitch between 1.8 um and 2.8 um—the rangeof pixel sizes for compact cameras and camera phones—for color filterthickness of 1.0 um. For less than 3%, a gap width below 0.35 um isneeded; for less than 1.5%, a gap width below 0.3 um; and for less than0.5%, a gap width below 0.25 um. FIG. 3I also shows that pixel loss isless for bigger pixels given the same gap width. Thus for pixels largerthan 5 um, the above guidelines result in at least halving the pixelloss.

Referring to FIGS. 2 and 5 again, it is clear that the first air-gap 422prevents crosstalk from the color filter of one pixel to an adjacentpixel by internal reflection. Thus the color filters 114B, 114G eachfunctions like a light guide. Together, the color filter, the secondlight guide, and the first light guide along ray a in FIG. 5 arecascaded together to capture incident light and convey to thephotoelectric conversion unit 102 while minimizing loss and crosstalk.Unlike prior art which uses metal walls or light absorbing walls betweencolor filters to reduce crosstalk, at the expense of losing light thatimpinging on such walls, the first air-gap 422 achieves negligible gaploss by diverting light to the nearest color filter. And since there isno underlying flattening layer below the color filters that bridgesbetween adjacent light guides like in prior art (see FIG. 1B), theassociated crosstalk is also eliminated.

Air interface may continue from the color filter sidewall along thesecond light guide sidewall and end above protection film 410, creatinga second air gap 424. The air interface between second air gap 424 andthe second light guide 130 enhances internal reflection for the secondlight guide 130.

A protection film 410 may be formed above insulating layer 110 ofsilicon nitride to prevent alkali metal ions from getting into thesilicon. Alkali metal ions, commonly found in color filter materials,can cause instability in MOS transistors. Protection film 410 also keepsout moisture. The protection film 410 may be made of silicon nitride(Si3N4) of thickness between 10,000 Angstroms and 4,000 Angstroms,preferably 7,000 Angstroms. If either first light guide 116 or secondlight guide 130 is made of silicon nitride, the protection film 410which is formed of silicon nitride is continuous across and above theinsulating layer 110 to seal the transistors from alkali metal ions andmoisture. If both first 116 and second 130 light guides are not made ofsilicon nitride, the protection film 110 may cover the top surface ofthe first light guide 116 to provide similar sealing or, alternatively,cover the sidewalls and bottom of first light guide 116.

First 422 and second 424 air gaps together form a connected opening toair above the top surface of the image sensor. Viewing this in anotherway, there exists a continuous air interface from the protection film410 to the top surfaces of the color filters 114B, 114G. In particular,there is an air-gap between the top surfaces 430 of the pixels. Theexistence of this opening during manufacture allows waste materialsformed during the forming of first air gap 422 and second air gap 424 tobe removed during the manufacture of the image sensor. If for somereason the first air-gap 422 is sealed subsequently using some plugmaterial, this plug material should have a refractive index lower thanthe color filter material so that (i) there is internal reflectionwithin the color filter, and (ii) light incident within the air-gap 422is diverted into the color filters 114B, 114G. Likewise if some fillmaterial fills the second air gap 424, this fill material needs to havea lower refractive index than the second light guide 130.

Together, the color filter 114 and light guides 130 and 116 constitute a“cascaded light guide” that guides light to the photoelectric conversionunit 102 by utilizing total internal reflection at the interfaces withexternal media such as the insulator 110 and air gaps 422 and 424.Unlike prior art constructions, light that enters the color filter doesnot cross over to the color filter of the next pixel but can onlypropagate down to the second light guide 130. This makes it unnecessaryto have a microlens above to focus light to the center of the pixel areato prevent light ray passing out from a color filter of a pixel to anadjacent pixel. Doing away with microlens has a benefit of eliminatingthe aforementioned problem of alignment error between microlens andcolor filter that can cause crosstalk, in addition to loweringmanufacturing costs.

As mentioned before, a cascaded light guide further holds an advantageover prior art that uses opaque wall material between color filters inthat incident light falling into the first air gap 422 between colorfilters 114B and 114G is diverted to either one, thus no light is lost,unlike prior art pixels where light is lost to the opaque walls betweenthe filters.

An advantage of this color filter forming method over prior art methodsis that the color filter sidewall is not defined by the photoresist anddye materials constituting the color filters. In prior art color filterforming methods, the color filter formed must produce straight sidewallsafter developing. This requirement places a limit on the selection ofphotoresist and dye material because the dye must not absorb light towhich the photoresist is sensitive, otherwise the bottom of the colorfilter will receive less light, resulting in color filter that isnarrower at its bottom than its top. The present color filter formingmethod forms the color filter sidewall by the pocket 210 etched into thesupport film 134 and not relying on the characteristics of the colorfilter material or the accuracy of lithography, resulting in a cheaperprocess.

Another advantage over prior art color filter forming methods is thatgap spacing control is uniform between all pixels, and highly accurateat low cost. Here, the gap spacing is a combination of the line-width inthe single lithography step that etches the openings in the supportfilm, plus the control of sideway etching during dry etch, both easilycontrolled uniformed and highly accurately without adding cost. If suchgaps were to be created by placing 3 color filters of different colorsat 3 different lithography steps as in the prior arts, uniformity of gapwidths is difficult, the lithography steps become expensive, andsidewall profile control becomes even more stringent.

A cascaded light guide wherein a color filter 114 and a light guide 130are formed in the same opening in the support film 134 (henceforth“self-aligned cascaded light guide”) has an advantage over prior art inthat there is no misalignment between the color filter 114 and the lightguide 130. The color filter 114 has sidewalls that self-align tosidewalls of the light guide 130.

FIGS. 4A-L show a process for forming an embodiment of the image sensorthis invention. The image sensor may be processed to a point where theconversion units 102 and electrodes 104 are formed on the siliconsubstrate 106 and the wires 108 are embedded in the insulator material110 as shown in FIG. 4A. The insulator 110 may be constructed from a lowrefractive index (“RI”) material such as silicon dioxide (RI=1.46). Thetop of the insulator 110 may be flattened with a chemical mechanicalpolishing process (“CMP”).

As shown in FIG. 4B, insulating material may be removed to form lightguide openings 120. The openings 120 have sloping sidewalls at an angleα. The openings 120 may be formed, by example, using a reactive ionetching (“RIE”) process. For silicon oxide as the insulating material, asuitable etchant is CF₄+CHF₃ in a 1:2 flow ratio, carried in Argon gasunder 125 mTorr, 45° C. The sidewall angle may be adjusted by adjustingthe RF power between 300 W and 800 W at 13.56 MHz.

FIG. 4C shows the addition of light guide material 122. By way ofexample, the light guide material 122 can be a silicon nitride that hasan index of refraction of 2.0, greater than the refractive index of theinsulating material 110 (e.g. silicon oxide, RI=1.46). Additionally,silicon nitride provides a diffusion barrier against H₂O and alkalimetal ions. The light guide material can be added for example by plasmaenhanced chemical vapor deposition (“PECVD”).

The light guide material may be etched down to leave a thinner andflatter protection film 410 to cover the insulator and seal theconversion unit 102, gate 104, and electrodes 108 against H₂O and alkalimetal ions during the subsequent processes. Alternatively, if the firstlight guide material 122 is not silicon nitride, a silicon nitride filmmay be deposited on top of light guide material 122 after an etch-downof the latter to flatten the top surface, to form a protection film 410that seals the conversion unit 102, gate 104, and electrodes 108 againstH₂O and alkali metal ions. The protection film 410 may be between 10,000Angstroms and 4,000 Angstroms thick, preferably 7,000 Angstroms.

A shown in FIG. 4D a support film 134 is formed on top of the siliconnitride. The support film 134 may be silicon oxide deposited by HighDensity Plasma (“HDP”).

In FIG. 4E, the support film is etched to form openings. The openingsmay include sidewalls 136 that slope at an angle β. The angle β isselected so that β<90−a sin (1/n2_(light guide)), where n2_(light guide)is the index of refraction of the second light guide material 130, suchthat there is a total internal reflection within the second light guides130. Incorporating two separate lights guides reduces the etching depthfor each light guide. Consequently, slope side wall etching is easier toachieve with higher accuracy. The support film 134 and second lightguides 130 may be made from the same materials and with the sameprocesses as the insulating layer 110 and first light guides 116,respectively.

As shown in FIG. 4E the sidewall may have a vertical portion and asloped portion. The vertical portion and sloped portion can be achievedby changing the etching chemistry or plasma conditions during theetching process. The etch recipe during the vertical portion etch isselected to be favorable for forming the vertical sidewall 162, thenswitched to a recipe favorable for forming the sloped sidewall.

FIG. 4F shows the addition of light guide material. By way of example,the light guide material can be a silicon nitride deposited for exampleby plasma enhanced chemical vapor deposition (“PECVD”).

FIG. 4G shows each second light guide 130 has a pocket 210. The pockets210 are separated by a support wall 212, being part of the support film134. Pocket 210 may be formed by etching down light guide material toexpose the wall 212 and further till the top surface of light guide isbelow the top surface of the wall 212 by between 0.6 um to 1.2 um.

As shown in FIG. 4H, a color film material 114B having a particularcolor, for example blue or magenta or yellow, may be applied to fill thepockets 210 and extends above the support film 134. In this example, thecolor material may contain blue dye. Color filter material is may bemade of negative photoresist, which forms polymers that when exposed tolight becomes insoluble to a photoresist developer. A mask (not shown)is placed over the material 114B with openings to expose areas that areto remain while the rest is etched away.

Color filter material used may comprise inorganic particles interspersedtherein that have diameters less than a small fraction, for instance aquarter, of the wavelengths of the light permitted to pass through. Forinstance, zirconium oxide and tantalum oxide particles of diameters lessthan 100 nm may be mixed in the blue color filter of this example.Particles of inorganic materials that are transparent to the intendedcolor and have high refractive index, preferably above 1.9, can increasethe overall refractive index of the color filter to enhance sidewallinternal reflection of the color filters used in this invention.

FIG. 4I shows the image sensor after the etching step. The process canbe repeated with a different color material such as green or red tocreate color filters for different pixels as shown in FIG. 4J. The lastcolor material applied fills the remaining pockets 210, thus requires nomask step. In other words, exposure light may be applied everywhere onthe image sensor wafer to exposure the last color filter filmeverywhere. During the bake step, the last color filter forms a filmthat overlaps all pixels, including pixels of other colors. The overlapof the last color filter on other pixels is removed during a subsequentcolor filter etch-down process shown in FIG. 4K.

Referring to FIG. 4G, the pockets 210 provide an self-alignment featureto self-align the color filter material with the second light guide 130.The pockets 210 may be wider than the corresponding mask openings. Toreduce the thickness of the support wall 212 for an desired second lightguide opening for a given pixel pitch, the pressure in the plasmachamber may be increased to enhance sideway (i.e. isotropic) etch (byincreasing ion scattering) to undercut the mask.

As shown in FIG. 4K the color filters 114B, 114G are etched down toexpose the support wall 212, being part of the support film 134. Aportion of the support film 134 is then removed as shown in FIG. 4L sothat there is an air/material interface for the color filters 114B,114G. A further portion of the support film 134 may be removed as shownin FIG. 4L so that there is an air/material interface for the secondlight guide 130 to further aid internal reflection by allowing lightrays closer to the perpendiculars to the interface to undergo totalinternal reflection. The first gap 422 has a width sufficiently small,0.45 um or less, so that incident red light and light of lesserwavelengths impinging into the first gap 422 is diverted to either colorfilter 114B or 114G, thus improving light reception. Light internallyreflects along the color filters 114B, 114G and light guides 130 and116. The color filters 114B, 114G have a higher refractive index thanair so that the color filters 114B, 114G provides internal reflection.Likewise, the second light guide 130 may have an air interface whichimproves the internal reflection properties of the guide. If the supportfilm 134 is not completely removed, as long as the support film has alower refractive index (e.g. silicon oxide, 1.46) than the light guidematerial (e.g. silicon nitride, 2.0), the interface between the secondlight guide 130 and the support film 134 has good internal reflection.FIG. 16 shows an alternate embodiment where the support material betweenthe adjacent second light guides 130 is only partially removed.Likewise, the interface between the first light guide 116 and the firstinsulator film 110 enjoys good internal reflection. FIG. 7 is a top viewshowing four pixels 200 of a pixel array. For embodiments that includeboth first and second light guides the area B may be the area of thesecond light guide top surface and the area C represents the area of thefirst light guide bottom surface. The area A minus the area B may be thearea of the first air gap 422 between color filters.

FIG. 17 shows an alternate embodiment where the support film 134 is onlypartially removed between adjacent color filters 114B, 114G. The gapunfilled by support film preferably has a depth of 0.6 um or greater anda width of 0.45 um or less. The depth may be reduced to 0.4 um if theoverall refractive index of the color filter material is increased above1.5, for instance by interspersing particles made of transparentmaterial that has a refractive index of 1.9 or above in an amount tobring the overall refractive index to 1.7˜1.8 or above.

FIG. 18 shows an alternate embodiment where opposite sidewalls of eachcolor filter are not straight and vertical. In this example, oppositesidewalls from adjacent color filters 114B, 114G sandwich a portion ofthe support film 134 in such a way that the support film 134 has a widerwidth at one depth than at a lower depth. With this property, thesupport film 134 exerts a downward force on each of the color filters114B, 114G to hold the color filters in place, thus improving colorfilter retention. In particular, in this example, the support film 134is wider at its top surface than at the deepest depth where it abuts theadjacent color filters 114B, 114G due to the color filters each taking atrapezoidal shape from the top of the support film 134 downwards. Whathelps to hold down the color filter here is a portion of a lateralinterface (i.e. sidewall) between the color filter and a solid structure(anchored from below) that tilts towards the color filter. This featureis present in FIG. 18 (sidewall between color filter 114B, 114G and wallformed by support film 134) and FIG. 19 (sidewall between color filter114B, 114G and wall formed by second support film 140). Although in thepresent embodiment the support wall 212 that remains from etching thesupport film 134 (and likewise the wall between color filters thatremains after etching the second support wall 140 in FIG. 19) providesthe solid structure anchored from below (by being a part of the supportfilm 212 in FIG. 18; by being in contact with support film 134 and lightguide material 130 in FIG. 19), it is possible to provide this solidstructure by depositing a thin film 142 of solid material into the airgap (without completely filling it) such that the solid film 142continues from a solid base below the air gap (e.g. support film 134 inFIG. 19) to a similarly (i.e. towards the color filter) tilted portionof a lateral sidewall of the color filter, overlapping both the lateralsidewall and the support film (see FIG. 21). For simultaneouslyachieving low costs, good color filter retention, good total internalreflection and low gap loss, the embodiment shown in FIG. 18 is the bestmode.

FIG. 20 shows an alternate processing step to a beginning portion of theprocessing step shown in FIG. 4E. Unlike in FIG. 4E where the pit etchedinto the support film 134 has a top portion having vertical sidewalls,FIG. 20 shows a processing step to initially open the pit such that ithas a wider bottom than an opening at the top. This may be achieved byopening the pit top by anisotropic plasma etching while rotating thewafer and holding the wafer at a tilt such that a normal to the wafermakes an angle to the direction of the incoming ions in the plasma. Asshown in FIG. 20, relative to the wafer, the incoming ions (in solidarrows and dotted arrows) etch into the support film under thephotoresist mask 450, creating sidewalls that are further apart deeperinto the pit. As seen in FIG. 20, a portion of the support film betweenadjacent pits exhibits a necking. After a pit top having this propertyis created, further processing may resume the remaining portion of thestep description in FIG. 4E, including switching to the correspondingplasma conditions, to create the remaining, lower portion of the pit forthe second light guide. In particular, sidewalls 136 of the second lightguide is formed below a necking of the support film 134.

FIG. 19 shows an alternate embodiment where color filters are formed intrenches formed separately from pits that house light guides. Colorfilters 114B, 114G, like in the alternate embodiment in FIG. 18, havesidewalls that are not vertical and straight. Between sidewalls ofadjacent color filters are second support film 140 and air gap 422.Color filters 114B, 114G are each above a second light guide 130. Eachfilter may have a bottom that is narrower than the top of second lightguide 130 by between 0.05 um to 0.2 um so that under worst casealignment errors each filter bottom is within the top of thecorresponding light guide below.

FIGS. 21A-21D illustrate processing steps to form the alternateembodiment of FIG. 19. The process is similar to FIGS. 4A-4G, exceptthere being no provision for a portion of the pit to house a colorfilter. After second light guide film above the support film 134 isremoved, either by etch-down or by CMP, the second light guide 130 andthe support film 134 may assume the shape shown in FIG. 21A. It is,however, not necessary for both to share a flush flat top, as the topsurface of second light guide 130 may be lower or higher than the top ofsupport film 134. In the latter, adjacent second light guides may bemutually connected by a thin layer of second light guide film left overfrom the etch-down or CMP. Subsequently, second support film 140 isdeposited. Second support film 140 may be silicon oxide or any materialthat may be removed by a wet etch or plasma etch that has a 4× or moreslower etch on color filter material to be used to form the colorfilters 114B, 114G. A lithography step (not shown) forms a photoresistmask (not shown) on the second support film 140, trenches are etchedinto the film 140 to result in the structure shown in FIG. 21B.Subsequently, color filters 114B, 114G are formed in steps similar todescribed for FIGS. 4H-4K, resulting into a structure shown in FIG. 21Cthen a subsequent one shown in FIG. 21D. Finally, an etch-down of secondsupport film 140 creates a gap 422 between adjacent color filters 114B,114G like shown in FIG. 19, in steps similar to described for FIG. 4L.

FIG. 8 shows an alternate embodiment where the second and first lightguides are both etched using the same mask after the support film 134 isformed, and both filled with light guide material in one step. A processfor fabricating this alternate embodiment is shown in FIGS. 9A-M. Theprocess is similar to the process shown in FIGS. 4A-L, except theopening for the first light guide is formed after the opening for thesecond light as shown in FIG. 9F, where no additional mask is neededbecause the protective film 410 and the support film 134 above act ashard masks to block etchants. Both light guides are filled in the samestep shown in FIG. 9G.

FIG. 22 shows an alternate embodiment comprising a sealing film 500above the light guides 130 and color filters 114B, 114G that sealsair-gap 422. Air gap 422 in this embodiment can hold air, nitrogen orother inert gases, or any gaseous medium. Sealing film 500 may comprisepolycarbonate or acrylic or epoxy and may comprise a plurality oflayers. It may further comprise inorganic particles, dye, or organicpigment for filtering ultra-violate light and/or infra-red light.Sealing film 500 may have a refractive index that is within 0.2 of therefractive index of the color filter material of color filter 114B, 114Gto minimize reflection at the interface between color filter and sealingfilm. If the refractive index of the color filters is 1.55, the sealingfilm 500 may be chosen to have refractive index between 1.45 and 1.65.Sealing film 500 may be applied by dynamic spin coating where the waferspins facing up at approximately 500 rpm while a stream of resin isdispensed at the center of the wafer through a dispensing tip and afterthe resin fluid completely wets the wafer top surface the wafer spins tohigher speed, e.g. 3000 rpm to obtain a uniform resin thickness. Theresin may be cured by heat or UV light. Air (or gas) is sealed in gap422 during the dispensing. Heating or UV shots may be applied duringeither one or both of dispensing and high-speed spin to promoteviscosity to prevent resin fluid from filling the gaps. Final heating orUV cure hardens the sealing film 500, and may help form boundary 510into a concave shape due to thermal expansion of air/gas in the gap 422.The concave film surface 510 helps to diverge light rays that enter intothe air gap from the sealing film 500 and direct the rays towards eithercolor filter 114G or 114B. As a result, the depth for air gap 422 may behalved compared with embodiment having no sealing film 500. The wafermay be faced downwards during high-speed spin. Portions of the sealingfilm 500 above bond pads may be removed by any one of the known methods.Sealing film 500 may be applied to any embodiments of image sensor 100discussed in this patent application.

FIG. 24 shows the image sensor 100 packaged in a package 800. A coverglass 810 is above the image sensor 100 to keep out dust and let lightin. Between cover glass 810 and image sensor 100, a transparent adhesivefilm 820 such as epoxy resin fills the space and is cured by heat or UVlight. Together, the sealing film 500 and the adhesive film 820constitute a transparent film filling the space between the cover glass810 and the color filters of the image sensor 100. If the sealing film500 and the adhesive film 820 comprise the same material(s), during thiscuring, the adhesive film 820 and the sealing film 500 can mergetogether into one homogeneous transparent film.

The example shown in FIG. 24 is a known wafer-level chip-scale packageknown under the trade name ShellOp from ShellCase, now Tessera. Thispackage is sealed from below by lower glass plate 815, held to the imagesensor 100 by epoxy 825. Inverted external leads 830 are electricallyconnected to die terminals 835 by trace contacts 840 at junctions 845.Junction 845 is sometimes referred to as a T-junction, and contact 840as a T-junction contact. External leads 830 are coated with a protectivesolder-mask 850. Solder-mask 850 is a dielectric material thatelectrically isolates leads 830 from external contact, and protects thelead surface against corrosion. Contacts 855 are attached to the bottomend of leads 830, and are suitable for printed circuit board (PCB)mounting by known methods. Contacts 855 may be formed by known methodssuch as solder-balls or plating, and may be suitably shaped for PCBmounted.

As shown in FIG. 23, from above the cover glass 810, incoming light rayspass through only flat interfaces to enter second light guides 130. Eachinterface has minimal reflection due to the small difference inrefraction indices on both sides, since glass has approximately 1.46,epoxy 820 and sealing film 500, and color filters 114B, 114G between1.45 to 1.65.

FIGS. 10A-H show a process to expose bond pads 214 of the image sensor.An opening 216 may be formed in a first insulator material 110 thatcovers a bond pad 214 as shown in FIGS. 10A-B. As shown in FIGS. 10C-Dthe first light guide material 116 is applied and a substantial portionof the material 116 may be removed, leaving a thinner layer to seal thefirst insulator material 110 below. The support film material 134 may beapplied and a corresponding opening 218 formed therein as shown in FIGS.10E-F. The second light guide material 130 may be applied as shown inFIG. 10G. As shown in FIG. 10H a maskless etch step may be used to forman opening 220 that exposes the bond pad 214. The etchant preferably hasa characteristic that attacks light guide material 116 and 130 (e.g.silicon nitride) faster than the insulator material 110 and 134 (e.g.silicon oxide) and color filter 114 (photoresist). Dry etch in CH₃F/O₂has 5×˜10× greater etch rate on silicon nitride than on color filter orsilicon oxide.

FIG. 11 shows an embodiment where an anti-reflection (AR) stackcomprising a top AR film 236, a second AR film 234, and a third AR film236 covers the conversion units 102. The anti-reflection stack improvesthe transmission of light from the first light guide 116 to theconversion units 102. Members of the AR stack together may constitutelayer 230 that also blanket the substrate 106, conversion units 102 andelectrodes 104 to protect the elements from chemical pollutants andmoisture. For example, the second AR film 234 may be a contact etch-stopnitride film common in CMOS wafer fabrication for stopping the oxideetching of contact holes to prevent over-etch of polysilicon contactswhose contact holes are shallower than source/drain contacts bytypically 2,000 Angstroms. The third AR film 232 may be silicon oxide.This silicon oxide film may be a gate insulating film under the gateelectrode 114, or the spacer liner oxide film that runs down the side ofthe gate electrode 114 between the gate and the spacer (not shown) incommon deep submicron CMOS processes, a silicide-blocking oxide filmdeposited before contact silicidation to block contact siliciding, or acombination thereof, or a blanket oxide film deposited aftersalicide-block oxide etch that etches away all oxide in areas coincidingwith the bottom of light guides 116. Using an existing silicon nitridecontact etch-stop film as part of the AR stack provides cost savings.The same contact etch-stop film also functions to stop the etch of theopening in insulator 110 for fabrication of the light guide. Finally,the top AR film 236 may be formed in the opening in the insulator 110prior to filling the opening with light guide material.

The top AR film 236 has a lower refractive index than the light guide116. The second AR film 234 has a higher refractive index than the topAR film 236. The third AR film 232 has a lower refractive index than thesecond AR film 234.

The top AR film 236 may be silicon oxide or silicon oxynitride, havingrefractive index about 1.46, with a thickness between 750 Angstrom and2000 Angstrom, preferably 800 Angstrom. The second AR film 234 may besilicon nitride (Si₃N₄), having refractive index about 2.0, with athickness between 300 Angstrom and 900 Angstrom, preferably 500Angstrom. The third AR film 232 may be silicon oxide or siliconoxynitride (SiOxNy, where 0<x<2 and 0<y<4/3), having refractive indexabout 1.46, with a thickness between 25 Angstrom and 170 Angstrom,preferably 75 Angstrom. The third AR film 232 may comprise the gateoxide under the gate 104 and above the substrate 106 of FIG. 2, as shownin FIG. 3 of U.S. Application 61/009,454. The third AR film 232 mayfurther comprise gate liner oxide as shown in FIG. 3 of the same.Alternately, the third AR film 232 may be formed by a blanket siliconoxide deposition everywhere on the wafer after a salicide-block etchremoves salicide-block oxide 64, gate-liner oxide 55, and gate-oxide 54shown in FIG. 2 of U.S. Application 61/009,454 by using asalicide-block-etch mask having a mask opening coinciding with thebottom of light guide 116.

The anti-reflection structure shown in FIG. 11 can be fabricated byfirst forming the third AR film 232 and the second AR film 234 over thesubstrate, respectively. The insulator 110 may be then formed on thesecond AR film 234. Silicon nitride film may be deposited by PECVD onthe first insulator 110 in a manner that covers and seals the insulatorand underlying layers to form a protection film 410 with a thicknessbetween 10,000 Angstrom and 4,000 Angstrom, preferably 7,000 Angstrom.The support film 134 may be formed on the protection film 410 by, forexample, HDP silicon oxide deposition.

The support film 134 is masked and a first etchant is applied to etchopenings in the support film 134. The first etchant may be chosen tohave high selectivity towards the protection film material. For example,if the support film 134 comprises HDP silicon oxide and the protectionfilm 410 comprises silicon nitride, the first etchant may be CHF₃, whichetches HDP silicon oxide 5 times as fast as silicon nitride. A secondetchant is then applied to etch through the silicon nitride protectionfilm 410. The second etchant may be CH₃F/O₂. The first etchant is thenapplied again to etch the first insulator 110 and to stop on the contactetch-stop film 234 which comprises silicon nitride. The contactetch-stop film 234 acts as an etchant stop to define the bottom of theopening. The top AR film 236 is then formed in the opening byanisotropic deposition methods, for example, PECVD or HDP silicon oxidedeposition, that deposits predominantly to the bottom of the openingthan to the sidewalls. An etchant can be applied to etch away anyresidual top AR film material that extends along the sidewalls of theopening, for example by dry etch using the first etchant and holding thewafer substrate at a tilt angle and rotated about the axis parallel tothe incoming ion beam. Light guide material is then formed in theopenings, for example by silicon nitride PECVD. Color filters may beformed over the light guide and a portion of the support film betweenadjacent color filters and a further portion between adjacent lightguides may be etched to create the structure shown in FIG. 5.

FIGS. 12A-E show a process for fabricating another embodiment ofanti-reflection between the light guide 116 and substrate 202. Referringto FIG. 12E, in this embodiment an etch-stop film 238 is interposedbetween the light guide 116 and the anti-reflection (AR) stackcomprising the top AR film 236, second AR film 234, and third AR film232. The light guide etch-stop film 238 may be formed of the samematerial as the light guide 116, and may be silicon nitride, with athickness between 100 Angstrom and 300 Angstrom, preferably 150Angstrom. Forming the AR stack in this embodiment has an advantage ofmore precise control of the thickness of the second AR film, at theexpense of one more deposition step and the slight added complexity ofetching through a oxide-nitride-oxide-nitride-oxide stack instead ofoxide-nitride-oxide stack for contact hole openings (not shown). Theprevious embodiment uses the second AR film 234 as a light guide etchstop and loses some of thickness to the final step of insulator pit etchover-etch.

As shown in FIGS. 12A-B, the third 232 and second 234 AR films areapplied on the substrate 106 and then a top AR film 236 is applied ontothe second AR film 234, followed by a light guide etch-stop film 238made of silicon nitride. As shown in FIG. 12C, the insulator layer 110and wiring electrodes 108 are formed above the AR films 232, 234, and236, and light guide etch-stop film 238. FIG. 12D shows an openingetched into insulator 110, stopping at the top of the light guideetch-stop film 238. FIG. 12E shows the opening filled with light guidematerial.

FIG. 13A is a graph of transmission coefficient versus light wavelengthfor the anti-reflection stack of FIG. 11 and FIG. 12E, for top AR film236 (oxide) nominal thickness of 800 Angstroms, and varied +/−10%,whereas second AR film 234 (nitride) thickness is 500 Angstroms andthird AR film 232 (oxide) thickness is 75 Angstroms. The transmissioncurves exhibit steep decline in the violet color region (400 nm to 450nm). The nominal thicknesses of the AR films 232, 234, and 236constituting the AR stack are chosen to position the maximum of thetransmission curve in the blue color region (450 nm to 490 nm) insteadof green color region (490 nm to 560 nm) so that any shift in filmthicknesses due to manufacturing tolerance would not result intransmission coefficient fall-off much more in violet than in red colorregion (630 nm to 700 nm).

FIG. 13B is a graph of transmission coefficient versus light wavelengthfor the anti-reflection stack of FIG. 11 and FIG. 12E, for nominalsecond AR film (nitride) of 500 Angstroms thick, and varied +/−10%.

FIG. 13C is a graph of transmission coefficient versus light wavelengthfor the anti-reflection stack of FIG. 11 and FIG. 12E, for third AR film232 (nitride) nominal thickness of 75 Angstroms, and varied +/−10%.

FIGS. 14A-G show a process for fabricating another embodiment ofanti-reflection stack between the light guides 116 and substrate 202 toprovide two different AR stacks at two different pixels that eachoptimizes for a different color region. Third and second AR film 232 and234 are provided over the photoelectric conversion unit 201 in FIG. 14A,similar to the embodiment shown in FIG. 12A. In FIG. 14A, the top ARfilm 236 is deposited to the thickness of thicker top AR film 236 bshown in FIG. 14B. Subsequently a lithography mask (not shown) isapplied to create mask openings over the pixels that use the thinner topAR film 236 a. An etch step is applied to thin the top AR film 236 underthe mask opening to the smaller thickness of top AR film 236 a in FIG.14B. Subsequent steps, shown in FIGS. 14C to 14G, are similar to FIGS.12B-E. Green color filters 114G may be applied on the pixels having thethinner top AR film 236 a, whereas Blue and Red color filters on thepixels having the thicker top AR film 236 b.

FIG. 15A is a graph of transmission coefficient versus light wavelengthfor the anti-reflection stack of FIG. 14G for a thinner top AR film 236a of nominal thickness 0.12 um, a second AR film 234 of nominalthickness 500 Angstroms, and a third AR film 232 of nominal thickness 75Angstroms. This graph peaks in the green color region at approximately99%, and drops gently to approximately 93% at the center of the redcolor region. This graph shows that the thinner top AR film 236 a can beused at red pixels as well as green pixels. This thinner top AR film 236a may be used at magenta pixels where magenta color is part of themosaic pattern of the pixel array of the image sensor.

FIG. 15B is a graph of transmission coefficient versus light wavelengthfor the anti-reflection stack of FIG. 14G for a thicker top AR film 236b of nominal thickness 0.20 um, a second AR film 234 of nominalthickness 500 Angstroms, and a third AR film 232 of nominal thickness 75Angstroms. This graph peaks in two separate color regions, viz. purpleand red. This graph shows that the top AR film 236 b can be used at bluepixels and red pixels. This thicker top AR film 236 b may be used atyellow pixels where yellow color is part of the mosaic pattern of thepixel array of the image sensor.

A pixel array may use the thinner top AR film 236 a for green pixelsonly while the thicker top AR film 236 b for both blue and red pixels.Alternately, the pixel array may use the thinner top AR film 236 a forboth green and red pixels while the thicker top AR film 236 b for bluepixels only.

Another embodiment to provide two different AR stacks that eachoptimizes for a different color region can be provided by creatingdifferent second AR film thicknesses while keeping the same top AR filmthickness. Two different thicknesses are determined, one for each colorregion. For example, thicknesses of 2800 Angstrom and optimizestransmission for blue and red lights, whereas thickness of 650 Angstromoptimizes for green lights. The second AR film is first deposited to thelarger thickness. Subsequently a lithography mask is applied to create amask opening over the pixels that uses the smaller second AR filmthickness. An etching step is applied to thin the second AR film underthe mask opening to the smaller thickness. Subsequent steps areidentical to FIGS. 12B-E.

While certain exemplary embodiments have been described and shown in theaccompanying drawings, it is to be understood that such embodiments aremerely illustrative of and not restrictive on the broad invention, andthat this invention not be limited to the specific constructions andarrangements shown and described, since various other modifications mayoccur to those ordinarily skilled in the art.

What is claimed is:
 1. An image sensor, comprising: a substrate; aphotoelectric conversion unit supported by said substrate; a colorfilter over said photoelectric conversion unit; a sealing film over saidcolor filter, said sealing film being transparent to visible lights;and, an air gap on a lateral side of said color filter and under aninterface of said sealing film, the interface being concave with respectto said sealing film.
 2. The image sensor of claim 1, wherein the colorfilter has at least a portion of lateral interface tilting towards thecolor filter, said portion being an interface between said color filterand a solid structure anchored from below.